Heaptalk, Jakarta — Honda Motor Co., Ltd. established a partnership with Renesas Electronics Corporation to develop a high-performance system-on-chip (SoC) for software-defined vehicles (SDVs). The agreement was announced during a Honda press conference held at CES 2025 in Las Vegas, Nevada (01/07).
The two companies have collaborated closely for many years. This collaboration is expected to expedite the integration of advanced semiconductor and software innovations into the Honda 0 Series, enhancing customers’ mobility experience.
This latest chip is designed to deliver AI performance of 2,000 tera operations per second (TOPS) and 20 TOPS per watt of power efficiency. It is planned for use in future models of the Honda 0 Series, a new electric vehicle (EV) series launched in the late 2020s.
Currently, the automaker is developing original SDVs to optimize the mobility experience for each customer in the Honda 0 Series. This EV will adopt a centralized E/E architecture that combines multiple electronic control units (ECUs) responsible for controlling vehicle functions into a single ECU.
The core ECU, which serves as the heart of the SDV, manages essential vehicle functions such as advanced driver assistance systems (ADAS) and automated driving (AD), powertrain control, and comfort features, all on a single ECU. To achieve this, the ECU requires a SoC that provides higher processing performance than traditional systems while minimizing any increase in power consumption.
Renesas provides automotive semiconductors that enable OEMs, including Honda, to develop SDVs. Its R-Car services offer AI performance with the ability to customize by leveraging multi-die chipset technology and integrating AI accelerators into its SoC.
